发布时间：2019-06-03 热度：1657
Key Features 1. Dual Socket P (LGA 3647) support 2. 16 DIMMs; up to 4TB 3DS ECC 3. 4 PCI-E 3.0 x16 (double-width) slots, 4. 8 Hot-swap 3.5" drive bays 5. 2x 10GBase-T LAN ports via Intel X550 6. 1 VGA, 2 COM, 5 USB 3.0 7. 4 Heavy duty fans, 4 exhaust fans, 8. 2200W Redundant Power Supplies 9. GPU Kit for passive GPU/Coprocessor
2nd Gen. Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡
DDR4-2933MHz† RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM††
2 PCI-E 3.0 x16 (single-width) slots,
1 PCI-E 3.0 x4 (in x8) slot
and 2 active heatsink with optimal
fan speed control
Titanium Level (96%)
support (MCP-320-74702-0N-KIT)
在线购买Key FeaturesFour hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:1. Du···...
在线购买Key Features• Up to 6 NVIDIA GPU1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-26···...
在线购买Key Features1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 ···...
在线购买Key Features - GPUs under Single-Root complex - Supports RDMA1. Dual socket R3 (LGA 2011) supports···...
在线购买Key Features1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 ···...
在线购买Key Features - 3D Rendering - Astrophysics, Chemistry - Cloud and Virtualization needs - Clo···...
在线购买Key Features1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 ···...
在线购买Key Features - Artificial Intelligence - Big Data Analytics - High-performance Computing - R···...
线上购买Key Features1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable p···...
