发布时间：2019-06-18 热度：1631

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Key Features
  - 3D Rendering
  - Astrophysics, Chemistry
  - Cloud and Virtualization needs
  - Cloud Computing
  - Compute Intensive Application
  - Dual Root System for balanced
     performance & higher CPU to GPU
     communication

1. Dual Socket P (LGA 3647) support
    2nd Gen. Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)^‡

2. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz^† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM^††

3. 8 PCI-E 3.0 x16 slots
    (support up to 8 double width GPU),
    2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4

4. Up to 24 Hot-swap 2.5" drive bays;
    8x 2.5" SAS/SATA drives supported
    with included H/W, 2x 2.5" NVMe
    drives supported with included H/W,
    1 NVMe based M.2 SSD

5. 2x 10GBase-T LAN ports via Intel C622

6. 8 Hot-swap 92mm RPM cooling fans

7. 2000W (2+2) Redundant Power Supplies
    Titanium Level (96%+)

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